1. 學士或碩士畢業學歷，電子電機等相關科系。2. 英文聽說讀寫中等，出差時間約1~3個月/年(美國為主)。3. 熟悉Power、Camera、RF peripheral (LTE/5G/GPS/Wifi/BT module) design architecture，3年以上相關經驗，包含FAE經驗尤佳。 4. 熟悉Automotive platform design (ISO 26262)、ARM Platform architecture、Camera(ToF)、mmWave、LiDAR尤佳。 5. Soldering skill.
1. HW system block diagram and board schematic design. 2. Define and check Layout placement and rule. 3. HW platform debugging, investigations, maintenance, alternative components survey and failure analysis. 4. Support documentation for projects.
意者請至104投遞履歷：硬體研發工程師