Packaging engineers play an important role at TI which encompasses the following responsibilities:
– New packaging development
– Die attach, mold, T&F process development to bring innovative and robust solutions on meeting new packaging requirements. Perform process characterization and conduct design-of-experiments to explore new process, material and packaging capability and deliver cutting edge solutions
– Work with global cross-functional team as an expert of new package and assembly process
– Work with machine, tooling and/or material vendors to develop new capabilities and bring new technologies to TI