Responsibilities include:
-Conduct functional test/bench test of failure IC and analyze failure mode according to all available data.
-Perform physical failure analysis toward the failure IC, including optical microscope inspection, IROM, SEM/EDX, 3D profiler, SEM cross-section, FIB, SAT, micro-probing and hotspot analysis (EMMI/InGaAs/OBIRCH) …etc.
-Collaborate with junior engineers and cross-functional teams to understand sensor failure mechanism.
-Review/analyze FA data and failure mechanism then summarize into English FA report in the format of word and powerpoint.