沅顧科技

semiconductor supply-chain, and/or ip/chiplet/sip design service and engineering turnkey
1. chiplets design flow
per given "bare-chips" (re-usability), we integrate from BOM1 to BOM2 migration and optimize the system PPA$ (performance, power, formfactor, cost).
1. 小芯片設計流程
根據給定的“裸芯片”(可重用性)，我們針對 BOM1 到 BOM2 遷移進行集成並優化系統 PPA$(性能、功率、外形、成本)。
2. from basic IoT to edge-AIoT;
decent SiP integration will enable sensor fusion, and edge-AI elevation.
2. 從基本IoT到邊緣AIoT
恰當的 SiP 集成將實現傳感器融合和邊緣人工智能提升。
3. design for foundry migration flexibility;
we facilitate lower-NRE of private-MPW strategy, from IP examination to chip production/capacity.
3. 設計為代工廠遷移彈性;
我們促進低 NRE的自有MPW策略，從 IP驗證到芯片生產/產能。